Funding

The Office of Advanced Manufacturing (OAM) provides cost-shared funding to pursue innovative technology R&D and increase energy efficiency across the manufacturing sector. Solicitations may involve collaborative partnerships among manufacturers, universities, suppliers, national labs, and others. Funding is awarded through an open, competitive process. Project selections are based on merit-based criteria that emphasize potential energy, environmental, and economic benefits. A variety of funding opportunities are available to manufacturers from OAM and other organizations.

Note: Official notices of solicitations can be found at http://www.grants.gov/.  This list is for information only—it may not be inclusive of all solicitations. Funding amounts and schedule dates are subject to change.

Open Opportunities

Notice of Funding Opportunity: CHIPS Manufacturing USA Institute

• U.S. Department of Commerce issued a NOFO to seek proposals from eligible applicants for activities to establish and operate a CHIPS Manufacturing USA institute focused on digital twins for the semiconductor industry. 

• The CHIPS for America Program anticipates up to approximately $285 million for a first-of-its kind institute focused on the development, validation, and use of digital twins for semiconductor manufacturing, advanced packaging, assembly, and test processes. 

• Full Applications are due June 20, 2024, and must be received at Grants.gov no later than 11:59 p.m. Eastern Time. Applications received after this deadline will not be reviewed or considered.

• Dr. Eric Forsythe, director, and Dr. Michael McKittrick, deputy director of the CHIPS Manufacturing USA Program, will provide a briefing on details of the NOFO on May 8, 2024, at 4:00 pm ET. Webinar participants must register in advance.

• On May 16, 2024, the CHIPS Manufacturing USA Program will host a one-day hybrid meeting for potential applicants for this funding opportunity. For more information and to register for this event, please click here.

Notice of Intent: AI for Resilient Manufacturing Institute

NIST announced its intent to have a competition for a new Manufacturing USA institute in early Spring 2024. The expected competition will seek to establish a Manufacturing USA institute focused on the use of Artificial Intelligence to improve the resilience of U.S. manufacturing.

Closed Opportunities

Manufacturing USA Workforce, Education and Vibrant Ecosystems (WEAVE) Public Service Awards

Through this Workforce, Education, and Vibrant Ecosystems (WEAVE) funding opportunity, NIST invites eligible Manufacturing USA institutes to propose high-impact public service projects to support vibrant and inclusive advanced manufacturing ecosystems that promote domestic production of institute-developed advanced manufacturing technologies and equitable access to good jobs.

Rapid Assistance (for) Coronavirus Economic Response (RACER) Grant Program

In this opportunity NIST invites AFFOA, AIM Photonics, America Makes, ARM, BioFabUSA, BioMADE, CESMII, CyManII, IACMI, LIFT, MxD, NextFlex, PowerAmerica, RAPID, & REMADE Manufacturing USA institutes to propose high-impact projects designed to fund awards for research, development, and testbeds to prevent, prepare for, and respond to coronavirus.

Advanced Manufacturing Technology Roadmap (MfgTech) Grant Program Funding Opportunity

The National Institutes of Standards and Technology (NIST) is seeking applications to develop technology roadmaps for promising advanced manufacturing clusters. These grants will establish new or strengthen existing industry-driven consortia that address high-priority research challenges to grow advanced manufacturing in the United States

Small Business Innovation Research (SBIR) Program Fast-Track for American Rescue Plan Act Funds

NIST has released a new SBIR funding opportunity funded through the American Rescue Plan. Awards will be made to support the purposes of the American Rescue Plan for ‘research, development, and testbeds to prevent, prepare for, and respond to coronavirus. The Fast-Track competition requires both Phase I and Phase II applications to be submitted together.